首页> 外国专利> Semiconductor chip, semiconductor integrated circuit including the semiconductor chip, semiconductor system including the semiconductor integrated circuit and method of driving the semiconductor system

Semiconductor chip, semiconductor integrated circuit including the semiconductor chip, semiconductor system including the semiconductor integrated circuit and method of driving the semiconductor system

机译:半导体芯片,包括该半导体芯片的半导体集成电路,包括该半导体集成电路的半导体系统以及驱动该半导体系统的方法

摘要

A semiconductor system including a semiconductor integrated circuit or a semiconductor chip, and a method of driving the semiconductor system are described. The semiconductor integrated circuit includes a plurality of semiconductor chips, at least one first chip through via suitable for penetrating through the plurality of semiconductor chips and interfacing a source ID code between the plurality of semiconductor chips, a plurality of second chip through vias suitable for penetrating through the plurality of semiconductor chips and interfacing a plurality of chip selection signals between the plurality of semiconductor chips, wherein the semiconductor chip uses one of chip selection signals as an internal chip selection signal in response to a chip ID code by selecting one of a unique ID code for the semiconductor chip and an alternative ID code for a preset semiconductor chip when the semiconductor chip fails.
机译:描述了包括半导体集成电路或半导体芯片的半导体系统以及驱动该半导体系统的方法。半导体集成电路包括:多个半导体芯片;至少一个第一芯片贯通孔,其适合于穿过多个半导体芯片,并且在多个半导体芯片之间连接源ID码;多个第二芯片贯通孔,其适于穿过通过多个半导体芯片并且在多个半导体芯片之间接口多个芯片选择信号,其中,响应于芯片ID码,半导体芯片通过选择唯一的一个来使用芯片选择信号之一作为内部芯片选择信号。当半导体芯片发生故障时,半导体芯片的ID代码和预设半导体芯片的备用ID代码。

著录项

  • 公开/公告号US9177625B2

    专利类型

  • 公开/公告日2015-11-03

    原文格式PDF

  • 申请/专利权人 SK HYNIX INC.;

    申请/专利号US201314019197

  • 发明设计人 JAE-BUM KO;

    申请日2013-09-05

  • 分类号G11C8;G11C8/12;G11C8/10;G11C29/44;

  • 国家 US

  • 入库时间 2022-08-21 15:19:58

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