首页> 外文会议> >Hybrid integration of polymers and semiconductors for photonic integrated circuits
【24h】

Hybrid integration of polymers and semiconductors for photonic integrated circuits

机译:用于光子集成电路的聚合物和半导体的混合集成

获取原文

摘要

Summary form only given. We combine polymers and semiconductors for application to high-performance photonic integrated circuits (PICs). We apply well-established semiconductor processing techniques to fabricate structures such as waveguides, gratings, pn junctions, and quantum wells. Then we use polymers to bond these samples to transfer substrates. Finally we etch away the growth substrate. With further processing we integrate the semiconductor circuit in the remaining epilayer with polymer waveguides. The end product is a photonic chip containing semiconductor only in the regions where there is an optical wave. The rest is made out of low-loss low-cost polymers containing low-loss optical guides which are almost identical to optical fibers. This technology is applied to high speed traveling wave modulators and tunable grating reflectors.
机译:仅提供摘要表格。我们将聚合物和半导体结合在一起,以应用于高性能光子集成电路(PIC)。我们应用完善的半导体加工技术来制造诸如波导,光栅,pn结和量子阱之类的结构。然后,我们使用聚合物将这些样品结合起来以转移底物。最后,我们蚀刻掉生长衬底。经过进一步的处理,我们将剩下的外延层中的半导体电路与聚合物波导集成在一起。最终产品是仅在存在光波的区域中包含半导体的光子芯片。其余部分由包含与光纤几乎相同的低损耗光导的低损耗低成本聚合物制成。该技术被应用于高速行波调制器和可调光栅反射器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号