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Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit

机译:包括电源的半导体集成电路,包括半导体集成电路的半导体系统以及形成半导体集成电路的方法

摘要

Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor integrated circuit. The semiconductor integrated circuit includes: a semiconductor substrate on a surface of which a plurality of electrical circuits and a plurality of power pads are mounted; an insulation layer stacked on the semiconductor substrate; a first conductive layer connected to a first power pad by a first via and stacked on the insulation layer; a second conductive layer connected to a second power pad by a second via, stacked on the insulation layer, and separated from the first insulation layer; and a power generation layer stacked on the first conductive layer and the second conductive layer and that generates voltage.
机译:提供了一种包括电源的半导体集成电路,包括该半导体集成电路的半导体系统以及形成该半导体集成电路的方法。该半导体集成电路包括:半导体基板,在其表面上安装有多个电路和多个电源焊盘;以及绝缘层堆叠在半导体衬底上;第一导电层通过第一通孔连接到第一功率焊盘并堆叠在绝缘层上;第二导电层通过第二通孔连接到第二电源焊盘,并堆叠在绝缘层上,并与第一绝缘层分开;发电层堆叠在第一导电层和第二导电层上并产生电压。

著录项

  • 公开/公告号US8093075B2

    专利类型

  • 公开/公告日2012-01-10

    原文格式PDF

  • 申请/专利权人 KYU-HYOUN KIM;CHANG-HYUN KIM;

    申请/专利号US20100656134

  • 发明设计人 KYU-HYOUN KIM;CHANG-HYUN KIM;

    申请日2010-01-19

  • 分类号H01L21/00;

  • 国家 US

  • 入库时间 2022-08-21 17:25:46

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