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Chip stack device testing method, chip stack device rearranging unit, and chip stack device testing apparatus
Chip stack device testing method, chip stack device rearranging unit, and chip stack device testing apparatus
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机译:芯片堆叠装置测试方法,芯片堆叠装置重新布置单元和芯片堆叠装置测试装置
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摘要
A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested.
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