CHIP STACKED DEVICE INSPECTION METHOD WHICH INSPECTS CHIP STACKED DEVICES OF DIFFERENT EXTERNAL SIZES, A CHIP STAKED DEVICE REARRANGEMENT UNIT, AND AN INSPECTION APPARATUS FOR A CHIP STACKED DEVICE

摘要

PURPOSE: A chip stacked device inspection method, a chip staked device rearrangement unit, and an inspection apparatus for a chip stacked device are provided to accurately and effectively inspect the chip stacked device with a low cost.;CONSTITUTION: A tray for a chip stacked device(25) has the same shape and external size as an inspection target plate before dicing. A bonding layer is arranged on the surface of the tray. The chip stacked devices are attached on an adhesive layer(26) of the tray by being matched on each chip position of the inspection target plate. The tray is installed on an inspection apparatus identical to the inspection target plate for inspecting the chip stacked devices attached on the adhesive layer.;COPYRIGHT KIPO 2012