Chip Stack Device Testing Method, Chip Stack Device Rearranging Unit, and Chip Stack Device Testing Apparatus

摘要

PROBLEM TO BE SOLVED: To enable accurate, efficient, and low-cost inspection of a multilayer-chip device including chips having different external dimensions.;SOLUTION: There is provided a multilayer-chip device inspection method for inspecting a multilayer-chip device configured by laminating a plurality of chips, which are diced and divided from an inspection-target substrate which has been inspected by inspection equipment. Each multilayer-chip device is inspected in such a way that: on an adhesive layer of a multilayer-chip device tray having the same shape and external dimension as the inspection-target substrate before dicing, one or more of the multilayer-chip devices are aligned with and adhesively supported at the positions where the respective chips were in the inspection-target substrate before dicing, and the multilayer-chip device tray is set on the inspection equipment in the same manner as in the inspection of the inspection-target substrate to carry out inspection.;COPYRIGHT: (C)2012,JPO&INPIT