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Bump structure and electronic packaging solder joint structure and fabricating method thereof
Bump structure and electronic packaging solder joint structure and fabricating method thereof
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机译:凸块结构和电子封装的焊点结构及其制造方法
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摘要
A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode.
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