FLEXIBLE WIRING BASE, WIRING SUBSTRATE, SOLAR CELL MODULE AND IC CARD

摘要

This flexible wiring base comprises: a base material; an adhesive layer that is formed of one or more layers and is laminated on the base material; and a metal foil that is bonded to the base material with the adhesive layer being interposed therebetween. The Vickers hardness of each layer constituting the adhesive layer is lower than the Vickers hardness of the base material, and at least one layer among the layer(s) constituting the adhesive layer has a Vickers hardness of 1 or more.