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Semiconductor ceramic, monolithic semiconductor ceramic capacitor, method for manufacturing semiconductor ceramic, and method for manufacturing monolithic semiconductor ceramic capacitor

机译:半导体陶瓷,整体式半导体陶瓷电容器,半导体陶瓷的制造方法以及整体式半导体陶瓷电容器的制造方法

摘要

In a semiconductor ceramic according to the present invention, a donor element within the range of 0.8 to 2.0 mol relative to 100 mol of Ti element is contained as a solid solution with crystal grains, an acceptor element in an amount less than the amount of the donor element is contained as a solid solution with the crystal grains, an acceptor element within the range of 0.3 to 1.0 mol relative to 100 mol of Ti element is present in crystal grain boundaries, and the average grain size of the crystal grains is 1.0 µm or less. A monolithic semiconductor ceramic capacitor is obtained by using this semiconductor ceramic. At that time, in a first firing treatment to conduct reduction firing, a cooling treatment is conducted while the oxygen partial pressure at the time of starting the cooling is set at 1.0 × 104 times or more the oxygen partial pressure in the firing process. In this manner, a SrTiO3 based grain boundary insulation type semiconductor ceramic having a large apparent relative dielectric constant εrAPP of 5,000 or more and a large resistivity logp (ρ: Ω·cm) of 10 or more even when crystal grains are made fine to have an average grain size of 1.0 µm or less, a monolithic semiconductor ceramic capacitor including the semiconductor ceramic, and methods for manufacturing them are realized.
机译:在根据本发明的半导体陶瓷中,相对于100mol的Ti元素,相对于Ti元素的固溶体,在0.8至2.0mol的范围内的施主元素以小于晶粒的固溶体的量包含。供体元素与晶粒以固溶体的形式存在,相对于Ti元素100摩尔,受主元素在晶界存在0.3〜1.0摩尔的范围,晶粒的平均粒径为1.0μm。或更少。通过使用该半导体陶瓷,可以得到单块的半导体陶瓷电容器。此时,在进行还原烧成的第一烧成处理中,在将冷却开始时的氧分压设定为氧的1.0×10 4 倍以上的同时进行冷却处理。烧成过程中的分压。这样,SrTiO 3 基晶界绝缘型半导体陶瓷的表观相对介电常数εr APP 为5,000以上,并且电阻率logp(ρ:Ω甚至当晶粒细化以具有1.0μm或更小的平均晶粒尺寸时,也可以是10或更大,从而实现了包括半导体陶瓷的整体式半导体陶瓷电容器及其制造方法。

著录项

  • 公开/公告号EP2371791A3

    专利类型

  • 公开/公告日2015-03-25

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO. LTD.;

    申请/专利号EP20110172063

  • 发明设计人 KAWAMOTO MITSUTOSHI;

    申请日2007-05-28

  • 分类号C04B35/47;H01G4/12;C04B35/628;C04B35/626;C01G23/00;C01G45/00;B82Y30/00;H01G4/30;

  • 国家 EP

  • 入库时间 2022-08-21 15:07:59

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