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HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE
HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE
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机译:导热压敏粘合层板,制造导热压敏粘合层板的方法和电子设备
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摘要
A heat-conductive pressure-sensitive adhesive layered sheet (F) provided with a heat-conductive pressure-sensitive adhesive layer having heat conducting properties and pressure-sensitive adhesive properties, and a non-adhesive layer not having pressure-sensitive adhesive properties, the heat-conductive pressure-sensitive adhesive layer being obtained by a polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) in a mixed composition including 100 parts by mass of a (meth)acrylic resin composition (A) including a (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (α1), 350 parts by mass to 1200 parts by mass of a flame-retardant heat-conductive inorganic compound (C), and 1 part by mass to 40 parts by mass of a tackifier (D), and the thickness of the non-adhesive layer being 70 µm or less.
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