首页> 外国专利> HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE

HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE

机译:导热压敏粘合层板,制造导热压敏粘合层板的方法和电子设备

摘要

A heat-conductive pressure-sensitive adhesive layered sheet (F) provided with a heat-conductive pressure-sensitive adhesive layer having heat conducting properties and pressure-sensitive adhesive properties, and a non-adhesive layer not having pressure-sensitive adhesive properties, the heat-conductive pressure-sensitive adhesive layer being obtained by a polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) in a mixed composition including 100 parts by mass of a (meth)acrylic resin composition (A) including a (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (α1), 350 parts by mass to 1200 parts by mass of a flame-retardant heat-conductive inorganic compound (C), and 1 part by mass to 40 parts by mass of a tackifier (D), and the thickness of the non-adhesive layer being 70 µm or less.
机译:导热性粘合剂层叠片(F)具有:具有导热性和粘合性的导热性粘合剂层;和不具有粘合性的非粘合性层。通过在包含100质量份的包含(甲基)丙烯酸的(甲基)丙烯酸树脂组合物(A)的混合组合物中,至少(甲基)丙烯酸酯单体(α1)的聚合反应获得导热性粘合剂层。 (甲基)丙烯酸酯聚合物(A1)和(甲基)丙烯酸酯单体(α1)相对于阻燃性导热性无机化合物(C)1200质量份为350质量份〜1200质量份,且为1质量份。增粘剂(D)的质量为40质量份,非粘合剂层的厚度为70μm以下。

著录项

  • 公开/公告号WO2015056577A1

    专利类型

  • 公开/公告日2015-04-23

    原文格式PDF

  • 申请/专利权人 ZEON CORPORATION;

    申请/专利号WO2014JP76435

  • 发明设计人 KUMAMOTO TAKUROU;KITAGAWA HIROMI;

    申请日2014-10-02

  • 分类号C09J7/02;C09J11/04;C09J11/08;C09J133/06;H05K7/20;

  • 国家 WO

  • 入库时间 2022-08-21 15:07:05

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