HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDING, THEIR MANUFACTURING METHOD, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive pressure-sensitive adhesive composition which is molded in a thin form with flexibility, and to provide a heat-conductive pressure-sensitive adhesive sheet-like molding, their manufacturing method, and an electronic component including the sheet-like molding.;SOLUTION: The heat-conductive pressure-sensitive adhesive composition (E) is obtained by the polymerization and crosslinking reaction of a (meth)acrylic acid ester monomer mixture (α1) in a mixed composition including: 100 pts.mass of a (meth)acrylic resin composition (A) including 5 mass% or more and 40 mass% or less of a (meth)acrylic acid ester polymer (A1), and 60 mass% or more and 95 mass% or less of the (meth)acrylic acid ester monomer mixture (α1) comprising a (meth)acrylic acid ester monomer (a5m), as a principal component, forming a homopolymer in which a glass transition temperature is -20°C or lower, and a polyfunctional monomer (a6m); 100 pts.mass or more and 550 pts.mass or less of a metal hydroxide (B) in which a BET specific surface area is 1.5 m²/g or less and an average particle diameter is 1.65 μm or more and 100 μm or less; 30 pts.mass or more and 550 pts.mass or less of a weak acid salt (D) of metal of group 1, group 2, group 12 or group 13 in a long periodic table; and 0.01 pts.mass or more and 10 pts.mass or less of a polymerization initiator (C).;COPYRIGHT: (C)2012,JPO&INPIT