HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDING, THEIR MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive pressure-sensitive adhesive composition and a heat-conductive pressure-sensitive adhesive sheet-like molding having high thermal conductivity and excellent handling workability at being molded thin, their manufacturing method and electronic equipment having the heat-conductive pressure-sensitive adhesive composition or the heat-conductive pressure-sensitive adhesive sheet-like molding.;SOLUTION: A mixed composition contains specified quantities of (A) a (meth)acrylic resin composition comprising (A1) a (meth)acrylic acid ester polymer and (α1) a (meth)acrylic acid ester monomer, and (B1) an expanded graphite powder having bulk specific gravity of 1 g/ml or less, (B2) a thermal conductive filler other than the expanded graphite powder (B1), and (C) a polyfunctional epoxy compound having 2 to 10000 functional groups. In the mixed composition, there are at least a polymerization reaction of the (meth)acrylic acid ester monomer (α1) and a crosslinking reaction of polymer comprising structural units derived from the (meth)acrylic acid ester polymer (A1) and/or the (meth)acrylic acid ester monomer (α1).;COPYRIGHT: (C)2014,JPO&INPIT