PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET USING PRESSURE-SENSITIVE ADHESIVE, MULTILAYER PRESSURE-SENSITIVE ADHESIVE SHEET USING PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC PART USING MULTILAYER PRESSURE-SENSITIVE ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive, to provide a pressure-sensitive adhesive sheet using the pressure-sensitive adhesive, to provide a multilayer pressure-sensitive adhesive sheet using the pressure-sensitive adhesive sheet and to provide a method for manufacturing an electronic part using the multilayer pressure-sensitive adhesive sheet.;SOLUTION: The pressure-sensitive adhesive comprises a (meth)acrylic ester polymer, a urethane acrylate oligomer having four or more vinyl groups and a silicone graft polymer. The multilayer pressure-sensitive adhesive sheet using the pressure-sensitive adhesive is excellent in chip retention during the dicing process and makes it easy to peel the chip when the pickup operation is performed. The multilayer pressure-sensitive adhesive sheet is suitable for use in a method for manufacturing an electronic part by picking up the chip with a die attach film layer attached to the back surface of the chip after dicing, mounting the chip on a lead frame or the like and bonding the chip to the lead frame or the like through curing by heating or the like.;COPYRIGHT: (C)2008,JPO&INPIT