Packaging method for MEMS devices for reducing thermal stress

摘要

In a method of packaging micro-electro-mechanical systems (MEMS) devices, an interposer board (102) is provided having a first surface (104) and an opposing second surface (106), with the interposer board including a plurality of electrical contacts (108) on the second surface. A plurality of shim layers (112) are bonded to the first surface of the interposer board, and a plurality of MEMS dies (120) are each separately bonded to a respective one of the shim layers. Each of the MEMS dies are electrically connected to the interposer board by wire bonding. A plurality of covers (130) are attached to the first surface of the interposer board over each of the MEMS dies to produce packaged MEMS devices. Each of the MEMS dies resides in a sealed cavity defined by a respective one of the covers and are substantially isolated from thermal stress.