机译:SOI MEMS器件中隔离包装应力的结构的设计与验证
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace Northwestern Polytechnical University Xi’an China;
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace Northwestern Polytechnical University Xi’an China;
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace Northwestern Polytechnical University Xi’an China;
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace Northwestern Polytechnical University Xi’an China;
Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace Northwestern Polytechnical University Xi’an China;
MEMS; Silicon-on-insulator; packaging; stress isolation structure;
机译:SOI MEMS器件中用于消除封装应力的结构的设计和验证
机译:一种使用先进的MEMS工艺对具有嵌入式垂直馈通的SOI-MEMS器件进行晶圆级气密封装的方法
机译:溅射封装作为可隔离MEMS器件的晶圆级封装:电容式加速度计上展示的一项技术
机译:先进的MEMS(aMEMS)工艺用于制造具有嵌入式垂直馈通的晶圆级真空封装SOI-MEMS器件
机译:通过“最小化”封装引起的应力,对精密MEMS封装进行“优化”设计。
机译:溅射封装作为可隔离MEMS器件的晶圆级封装:电容式加速度计上展示的一项技术
机译:溅射封装作为可隔离mEms器件的晶圆级封装:在电容式加速度计上展示的技术
机译:118-H-6:2,105-H反应堆辅助支撑区域,低于等级结构和下层土壤的清理验证包; 118-H-6:3,105-H反应堆燃料储存盆和下层土壤; 118-H-6:3燃料储存盆地深区边坡土壤; 100-H-9,100-H-10和100-H-13法国排水沟; 100-H-11和100-H-12扩展盒法国排水管;和100-H-14和100-H-31表面污染区