首页> 外国专利> SEMICONDUCTOR LAMINATE AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, DOPANT COMPOSITION, DOPANT INJECTION LAYER, AND METHOD FOR FORMING DOPED LAYER

SEMICONDUCTOR LAMINATE AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, DOPANT COMPOSITION, DOPANT INJECTION LAYER, AND METHOD FOR FORMING DOPED LAYER

机译:半导体叠层及其制造方法,半导体器件的制造方法,半导体器件,掺杂剂组成,掺杂剂注入层以及形成掺杂层的方法

摘要

A first aspect of the present invention provides a method for producing a semiconductor laminate comprising a substrate having formed thereon a silicon layer with small surface unevenness and high continuity.;The method of the first aspect of the present invention for producing a semiconductor laminate having a substrate 10 and a sintered silicon particle layer 5 on the substrate comprises (a) coating a silicon particle dispersion containing a dispersion medium and silicon particles dispersed in the dispersion medium, on a substrate 10 to form a silicon particle dispersion layer 1, (b) drying the silicon particle dispersion layer 1 to form a green silicon particle layer 2, (c) stacking a light-transmitting layer 3 on the green silicon particle layer, and (d) irradiating the green silicon particle layer 2 with light through the light-transmitting layer 3 to sinter the silicon particles constituting the green silicon particle layer 2, and thereby form a sintered silicon particle layer 5.
机译:本发明的第一方面提供一种用于制造半导体层压板的方法,该半导体层压板包括在其上形成有表面不平整度小且连续性高的硅层的基板。基板10和基板上的烧结硅颗粒层5包括(a)在基板10上涂覆包含分散介质和分散在分散介质中的硅颗粒的硅颗粒分散体,以形成硅颗粒分散层1,(b)干燥硅颗粒分散层1以形成绿色硅颗粒层2,(c)在绿色硅颗粒层上堆叠透光层3,以及(d)通过光照射绿色硅颗粒层2-透过层3烧结构成生硅粒子层2的硅粒子,从而形成烧结硅粒子层5。

著录项

  • 公开/公告号EP2833391A1

    专利类型

  • 公开/公告日2015-02-04

    原文格式PDF

  • 申请/专利权人 TEIJIN LIMITED;

    申请/专利号EP20130768368

  • 申请日2013-03-29

  • 分类号H01L21/20;H01L21/208;H01L21/225;H01L21/336;H01L29/786;H01L31/04;

  • 国家 EP

  • 入库时间 2022-08-21 15:03:49

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