Surface pressure measurement device in apparatus for bonding substrates and method for bonding substrates using the same

摘要

The present invention relates to a substrate laminating method using the surface pressure measuring device and this substrate for cementation device, and the substrate surface pressure measuring apparatus for laminating apparatus, the upper surface plate and the surface pressure on the entire area along the contact of the lower surface plate, characterized in that comprises a measurement device to measure the surface pressure, and a substrate laminating method using such a surface pressure measuring apparatus, (a ) via the method comprising: measuring the surface pressure between the upper platen and the lower platen unit; (B) measuring the surface pressure of the contact pressure measuring device according to Sikkim in close contact with the lower platen by lowering the upper platen is an upper platen and the lower platen; (C) the surface pressure is equal to or less than the total area according to the standard deviation of the measurement of the surface pressure measuring apparatus, the surface pressure to remove the measuring device, in that it comprises the step of performing a process of laminating two substrates, characterized, and thus The total area of the surface pressure and the lower surface plate and the upper surface plate is only made if the cementation process is constant, if a particular site is the contact pressure of the whole area because of a tilted does not match, the cementation process be done by being caught immediately after it, This occurs due to poor cementation is minimized provided the effect of improving the efficiency of the cementation process eventually. ;