FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE PROCESS FOR PRODUCING STRIP FILM FOR SEMICONDUCTOR BACK SURFACE AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film for a flip-chip type semiconductor back surface, which can keep high cutting precision thereof.;SOLUTION: The film 2 for a flip-chip type semiconductor back surface is formed on the back surface of a semiconductor element which is flip-chip connected on an adherend, wherein A/B lies within the range of 1-8×10³ (%/GPa) when the elongation at 23°C of the film for the flip-chip type semiconductor back surface before thermosetting is A, and the tensile storage elastic modulus at 23°C of the film for the flip-chip type semiconductor back surface before thermosetting is B.;COPYRIGHT: (C)2012,JPO&INPIT