Breakthrough in flip chip semiconductor process

摘要

Nextreme, a manufacturer of micro-scale thermal and power management products for the electronics industry, has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. This breakthrough in flip chip process technology addresses two of the most serious issues in electronics today -thermal and power management constraints. Nextreme's approach uses proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.