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SUPPORTING BODY FOR A SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCTION OF A SUPPORTING BODY

机译:用于半导体元件的支撑体,半导体元件以及用于制造支撑体的方法

摘要

A carrier body for a semiconductor component, in particular for an optoelectronic semiconductor component, is specified. Said carrier body has a connecting layer and a conductor layer, which are connected to one another via main areas facing one another. The connecting layer, the conductor layer or both the connecting layer and the conductor layer has/have at least one thinned region in which the layer thickness of said layer(s) is less than the maximum layer thickness of said layer(s). The connecting layer is either completely electrically conductive and electrically insulated at least from parts of the conductor layer or it is electrically insulating at least in parts. Furthermore, a semiconductor component comprising the electrical connection conductor and also a method for producing the carrier body are specified.
机译:提出了一种用于半导体器件,尤其是用于光电子半导体器件的载体。所述载体具有连接层和导体层,它们通过彼此面对的主要区域相互连接。连接层,导体层或连接层和导体层两者具有/具有至少一个变薄的区域,其中所述一个或多个层的层厚度小于所述一个或多个层的最大层厚度。连接层或者是完全导电的并且至少与导体层的一部分电绝缘,或者至少部分是电绝缘的。此外,提出一种包括电连接导体的半导体部件以及一种用于制造载体的方法。

著录项

  • 公开/公告号EP2345074B1

    专利类型

  • 公开/公告日2016-08-24

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号EP20090771481

  • 发明设计人 ZITZLSPERGER MICHAEL;MÜTZEL STEFANIE;

    申请日2009-10-22

  • 分类号H01L33/48;H01L23/495;H01L31/0203;H01L23/31;H01L23;H01L33/62;H01L33/52;

  • 国家 EP

  • 入库时间 2022-08-21 14:52:35

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