There is disclosed an apparatus for use in an electroetching or electrodeposition process in which material is etched from or deposited onto the surface of an electrically conductive component. The apparatus comprises a support for supporting the component within a tank containing an electrolytic solution; and a first-polarity electrode arranged to be located within the tank and immersed in the electrolytic solution and shaped to surround at least a part of the component in a contactless manner. In use, an electric field produced by the first-polarity electrode results in an electric variance between at least a part of the component and a second-polarity electrode having a polarity opposite to that of the first-polarity electrode. An electroetching and an electrodeposition process are also disclosed.
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