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Copper electrodeposition on pyrolytic graphite electrodes: Effect of the copper salt on the electrodeposition process

机译:热解石墨电极上的铜电沉积:铜盐对电沉积过程的影响

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The electrodeposition of copper on pyrolytic graphite from CuSO{sub}4 or Cu(NO{sub}3){sub}2 in a 1.8 M H{sub}2SO{sub}4 aqueous solution was investigated. The Cu deposits were formed potentiostatically and characterized by electrochemical methods, scanning electron microscopy, energy dispersive X-ray and X-ray photoelectron spectroscopy. It was found that the deposition of copper in the presence of CuSO{sub}4 induced the codeposition of sulfate anions. In addition, electrochemical quartz crystal microbalance revealed that the increase of the Cu mass was higher than expected from Faraday's law with the CuSO{sub}4/H{sub}2SO{sub}4 solution. These results confirmed the specific adsorption of anions during the Cu deposition. On the other hand, the use of Cu(NO{sub}3){sub}2 resulted in a non-contaminated surface with different surface morphologies. The Cu nuclei size, the population density and the surface coverage were monitored as a function of the deposition potential. From the analysis of the chronoamperometric curves, the nucleation kinetics was studied by using various theoretical models. Independently of the Cu source, the nucleation mechanism follows a three-dimensional (3D) process. Copper nucleates according to an instantaneous mode when the deposition potential is more negative than - 300 mV versus Ag/AgCl, while the nucleation was interpreted in terms of a progressive mode at -150 mV. The nuclei population densities were also determined by using two common fitting models for 3D nucleation and growth (Scharifker-Mostany and Mirkin-Nilov-Heerman-Tarallo). Their values are reported here as a function of the deposition potential.
机译:研究了铜在1.8 M H {sub} 2SO {sub} 4水溶液中在CuSO {sub} 4或Cu(NO {sub} 3){sub} 2上在热解石墨上的电沉积。铜沉积物是恒电位形成的,并通过电化学方法,扫描电子显微镜,能量色散X射线和X射线光电子能谱进行表征。发现在CuSO 3的存在下铜的沉积引起硫酸根阴离子的共沉积。此外,电化学石英晶体微天平显示,使用CuSO {sub} 4 / H {sub} 2SO {sub} 4溶液,Cu质量的增加高于法拉第定律的预期。这些结果证实了在Cu沉积过程中阴离子的特异性吸附。另一方面,Cu(NO {sub} 3){sub} 2的使用导致具有不同表面形态的未被污染的表面。监测铜核尺寸,人口密度和表面覆盖率与沉积电位的关系。通过对计时电流曲线的分析,使用各种理论模型研究了成核动力学。与铜源无关,成核机制遵循三维(3D)过程。当沉积电位相对于Ag / AgCl大于-300 mV时,铜会根据瞬时模式成核,而成核是根据-150 mV的渐进模式来解释的。还使用两个常见的3D成核和生长拟合模型(Scharifker-Mostany和Mirkin-Nilov-Heerman-Tarallo)确定了核的种群密度。它们的值在此报告为沉积电位的函数。

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