THE ELECTROLYTE SOLUTION CONTAINING BROMIDE ION FOR COPPER ELECTRODEPOSITION AND COPPER ELECTRODEPOSITION METHOD USING THE SAME

摘要

The present invention relates to an electrolyte solution for copper electroplating containing bromine ions and a copper electroplating method. The electrolyte solution for copper electroplating according to the present invention contains deionized water, copper ions, a supporting electrolyte, chlorine ions and bromine ions, and it is possible to fill TSVs and microvias without defects by additionally adding an accelerator and a moderator. . In addition, since the organic leveling agent is not used, it is easy to maintain and manage electrolyte properties, and the economical efficiency of the electroplating process can be improved by using a bromine compound at a low price instead of an expensive leveling agent.