COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier high in adhesion force between the carrier and a metal layer before a laminating process to an insulation substrate and capable of easily peeling the carrier from the metal layer without extreme increase or decrease of adhesiveness of the carrier and the metal layer in the laminating process to the insulation substrate.SOLUTION: There is provided a metal foil with a carrier having the carrier, a first intermediate layer containing oxygen and a metal layer in this order, average value of depth from a surface in an intermediate layer side of the peeled carrier in terms of SiOtill oxygen at 10 locations becomes 10 at% or less is 0.5 nm to 15 nm inclusive and standard deviation/average value is 0.6 or less when peeling the carrier from the metal foil with the carrier according to JIS C6471 and conducting analysis of total 10 locations which are 5 locations with 20 mm interval in a width direction (TD direction) and 5 locations with 20 mm interval in a longer direction (MD direction) in the depth direction by AES from the intermediate side of the peeled carrier.SELECTED DRAWING: Figure 5