Optoelectronic components, opto-electronic devices, and a method of manufacturing the opto-electronic devices

摘要

optoelectronic component has a housing with an upper surface (201) and a lower surface base having a (202) (200) and cap (300). Optoelectronic component also has a laser chip (400) disposed between the base of the upper surface and the cap. The first solder contact region (210) and the second solder contact region (220) is formed on the lower surface of the base portion. The base is suitable for surface mounting onto conductor tracks, a plurality of optoelectronic components are connected in series. Each optoelectronic component is mounted on the electrically insulating carrier (240), and has a wire laser chip connected to the pin (260) by (215) (400). Pin is electrically insulated from the base by a glass insulating portion (265). The second contact to the base (200) is formed by a further wire (225)FIELD 3