Substrate for a power module with a heat sink, board and power module for a power module with a cooler

摘要

PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink capable of restraining a progress of cracks in a solder layer interposed between a metal layer consisting of Al and the heat sink consisting of Cu, and having the excellent junction reliability.;SOLUTION: A power module substrate 20 with a heat sink comprises: a power module substrate 10 in which a circuit layer 12 is arranged on a surface of a ceramic substrate 11 and a metal layer 13 consisting of Al is arranged on an other surface of the ceramic substrate 11; and the heat sink 18 bonded to the other surface side of the metal layer 13 via a solder layer 17. The metal layer 13 is formed by bonding an Al plate with the Al content of 99.0 mass% to 99.85 mass% to the ceramic substrate 11, the heat sink 18 is formed of Cu or Cu alloy having a tensile strength of equal to or more than 250 MPa.;COPYRIGHT: (C)2014,JPO&INPIT