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Localized surface plasmon resonance chip and localized surface plasmon resonance sensor for sensor

机译:局部表面等离子体共振芯片和用于传感器的局部表面等离子体共振传感器

摘要

PROBLEM TO BE SOLVED: To provide a chip for a high sensitivity localized surface plasmon resonance sensor.SOLUTION: A structure body in which a chip for a localized surface plasmon resonance sensor has a plane part and a cylindrical body, and the cylindrical body is erected with an opening faced to the plane of the plane part, and the average inner diameter of the opening of the cylindrical body is ranging from 5 nm or more to 2,000 nm or less, and the rate (A/B) of an inner diameter A of the opening of the cylindrical body to an inner diameter B at an intermediate point of depth from the opening of the cylindrical body is ranging from 1.00 or more and 1.80 or less, and the bottom part of the cylindrical body is an aspheric surface, is formed on a substrate. A metallic layer is formed such that at least a part of the surface of the structure is covered, and that the structure of the structure body is reflected.
机译:解决的问题:提供用于高灵敏度的局部表面等离子体共振传感器的芯片。解决方案:一种结构体,其中用于局部表面等离子体共振传感器的芯片具有平面部分和圆柱体,并且将圆柱体竖立开口面向平面部的平面,圆柱体的开口的平均内径在5nm以上至2,000nm以下的范围内,内径A的比率(A / B)圆柱体的开口在距圆柱体的开口的深度的中间深度处的内径B的范围为1.00以上且1.80以下,并且圆柱体的底部为非球面。在基板上形成。形成金属层,使得覆盖结构的至少一部分表面,并且反射结构体的结构。

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