首页> 外国专利> TECHNIQUES FOR IMPROVING GATE CONTROL OVER TRANSISTOR CHANNEL BY INCREASING EFFECTIVE GATE LENGTH

TECHNIQUES FOR IMPROVING GATE CONTROL OVER TRANSISTOR CHANNEL BY INCREASING EFFECTIVE GATE LENGTH

机译:通过增加有效栅极长度来改善对晶体管通道的栅极控制的技术

摘要

Techniques are disclosed for improving gate control over the channel of a transistor, by increasing the effective electrical gate length (Leff) through deposition of a gate control layer (GCL) at the interfaces of the channel with the source and drain regions. The GCL is a nominally undoped layer (or substantially lower doped layer, relative to the heavily doped S/D fill material) that can be deposited when forming a transistor using replacement S/D deposition. The GCL can be selectively deposited in the S/D cavities after such cavities have been formed and before the heavily doped S/D fill material is deposited. In this manner, the GCL decreases the source and drain underlap (Xud) with the gate stack and further separates the heavily doped source and drain regions. This, in turn, increases the effective electrical gate length (Leff) and improves the control that the gate has over the channel.
机译:公开了通过在沟道与沟道的界面处沉积栅极控制层(GCL)来增加有效电栅极长度(L eff )来改善对晶体管沟道的栅极控制的技术。源极和漏极区域。 GCL是名义上未掺杂的层(或相对于重掺杂的S / D填充材料而言,基本上是较低的掺杂层),可在使用替换S / D沉积形成晶体管时进行沉积。在已经形成G腔之后,在沉积重掺杂的S / D填充材料之前,可以将GCL选择性地沉积在S / D腔中。以此方式,GCL减小了具有栅极叠层的源极和漏极重叠部分(X ud ),并进一步分隔了重掺杂的源极和漏极区域。继而,这增加了有效的电气栅极长度(L eff ),并改善了栅极对沟道的控制。

著录项

  • 公开/公告号US2016240534A1

    专利类型

  • 公开/公告日2016-08-18

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US201315024258

  • 申请日2013-12-18

  • 分类号H01L27/092;H01L21/265;H01L29/40;H01L29/78;H01L21/8238;H01L29/66;H01L29/06;

  • 国家 US

  • 入库时间 2022-08-21 14:37:11

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