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Structures formed using monocrystalline silicon and/or other materials for optical and other applications

机译:使用单晶硅和/或其他材料形成的结构,用于光学和其他应用

摘要

To fabricate an interposer for interfacing waveguides (e.g. optical fiber cables) to transducers, a cavity (410) is formed in a top surface of a substrate. A first layer (520) is formed over the cavity's bottom surface, with one or more gaps in the first layer's top surface. A second layer (3410) is formed in the one or more gaps. The second layer overlaps the first layer. At least part of the first layer is removed to form channels separated from each other by portions of the second layer that are located in the one or more gaps; at least part of the first layer is removed from under the second layer. The second layer portions in the one or more gaps provide one or more spacers in the cavity; these one or more spacers at least partially cover the channels. Waveguides can be placed into the channels.
机译:为了制造用于将波导(例如,光纤电缆)与换能器接口连接的插入件,在衬底的顶表面中形成腔(410)。在腔的底表面上方形成第一层(520),在第一层的顶表面中具有一个或多个间隙。在一个或多个间隙中形成第二层(3410)。第二层与第一层重叠。去除第一层的至少一部分以形成通道,该通道被位于一个或多个间隙中的第二层的部分彼此分隔;从第二层下面去除第一层的至少一部分。一个或多个间隙中的第二层部分在空腔中提供一个或多个隔离物;这些一个或多个隔离物至少部分地覆盖通道。可以将波导放置在通道中。

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