Electronic package with embedded materials in a molded structure to control warpage and stress

摘要

A method and system are provided for an electronic package with embedded materials in a molded structure to control warpage and stress. A first material can be deposited on a substrate with a semiconductor die. The substrate can be a coreless substrate. The substrate with the semiconductor die can be placed in a mold tool that when closed defines a space about the semiconductor die. A second material, such as an epoxy mold compound, for example, can be applied to the defined space to produce a mold cap in which the first material is at least partially embedded in the second material. The first and second materials can have a different modulus and/or coefficient of thermal expansion. The first material can be used to cover electrical components on a surface of the substrate. In some instances, more than one material can be at least partially embedded in the second material.