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A process and apparatus for producing bakery products in the form of half shells
A process and apparatus for producing bakery products in the form of half shells
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机译:用于生产半壳形式的烘焙产品的方法和设备
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摘要
A process and apparatus for producing bakery products in the form of half shells.In a process for the production of half shells (2) which is made of a dough for bakery products and have a distinctive ring annular orifice (6) with a finished surface, through the production of a sheet of wafer (1) comprising a plurality of half shells (2) connected S to each other by a wall of the interconnection (4),Shaping and baking the dough in a form with the use of a form composed of two additional plates (12,14) having respective front surfaces which, as a result of the fit of the two plates may define a cavity forming and generally corresponding to the re The wound sheet of wafer (1),A form is used in which the surface of the frontal shape of at least one of said plates have formed parts (26) which are projected toward the front of the supefu00edcie another plate (12) and which may define, in the mass that is subjected to baking in the inner cavity of ocnformau00e7 So, a slot (24) in the wall of the interconnection (4) adjacent to each half shell (2),In which the plates can be assembled together in an initial position, in which the forming cavity has a volume smaller than the volume of the sheet of wafer is obtained, the mass is subjected to a first stage of cooking in the cavity formed by the partial forms assembled together in the posi The original government,While the volume of the cavity of conformation is maintained constant until the mass is partially solidified, the dough is then subjected to cooking end with an increase in the voume cavity conformation.In order to obtain a sheet of wafer (1) where the half shells (2) are connected to the wall of the interconnection (4) by an annular region (28) that has a thickness that is substantially less than the thickness of the wall of the interconnection (4); the half shells can thus be separated from the sheet Wafer for a small pressure exerted in a direction perpendicular to the plane of the sheet of wafer.
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