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SUBSTRATE PROCESSING DEVICE, SUBSTRATE CONVEYANCE METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
SUBSTRATE PROCESSING DEVICE, SUBSTRATE CONVEYANCE METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
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机译:基板处理装置,基板对流法,半导体装置的制造方法以及记录介质
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摘要
Provided is a configuration comprising: a substrate holding tool holding a substrate; a detection unit that detects the placement state of the substrate held by the substrate holding tool; a first determination unit that compares detection data for the substrate, obtained by the detection unit, and master data serving as a reference and not obtained beforehand, and determines whether or not the detection data for the substrate is within a first permissible value; a confirmation unit that confirms the substrate type; a second determination unit that compares the detection data for the substrate and the master data and determines whether or not the detection data is within a second permissible value; and a conveyance control unit that controls the substrate holding tool in accordance with the determination results from the second determination unit, if, as a result of the determination by the first determination unit, a determination has been made that the detection data is outside the first permissible value and if the confirmation unit has confirmed that the substrate is a prescribed type.
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