A PCB package bonding pad structure regarding a double row pin device, comprising a PCB board (8). The PCB board is provided with a double row bonding pad (2); the bonding pad is in an oval shape, and is provided with a circular drill hole (1); the centre of the circle of the circular drill hole is located on a long axis of the bonding pad; the circular drill hole deviates towards the bonding pad; the periphery of the bonding pad is also provided with a solder resistance bridge (3); and the solder resistance bridge matches the periphery of the bonding pad. The present invention has a simple structure and low costs, so that a routing not longer than 5 mil can be led between two bonding pads when wiring, thereby greatly saving space; and can avoid narrow slope pad of the bonding pad, avoid a solder-connected short circuit between two pins, and may not generate false welding and device fall-off during welding.
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