BONDING PAD STRUCTURE AND METHOD OF MANUFACTURING THE BONDING PAD STRUCTURE, AND SEMICONDUCTOR PACKAGE HAVING THE BONDING PAD STRUCTURE

摘要

A bonding pad structure and method of manufacturing a bonding pad structure are provided to prevent oxidation of the lower pad of the bonding pad structure by make the lower pad not exposed to the outside when the upper pad is damaged. An upper pad(120) comprises a first area covered with a passivation film and a second part exposed from the passivation film(140). The lower pad is positioned under the first region of the upper pad in order not to be exposed through the second part. The lower pad(110) is electrically connected to the upper pad, and a contact member electrically connects the upper pad and the lower pad. The lower pad consecutively has a connected loop shape, and a contact member comprises a plurality of plug(130) which partly contact with the lower pad.