BONDING PAD STRUCTURE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING BONDING PAD STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a bonding pad structure which prevents exposure of a lower pad to an environment irrespective of damage of an upper pad.;SOLUTION: The bonding pad structure includes a passivation film 140, an upper pad 120, a lower pad 110, and a contact member 130. The upper pad has a first region covered with the passivation film and a second region exposed from the passivation film. The lower pad is located under the first region of the upper pad so as not to be exposed through the second region. The contact member is interposed between the upper pad and the lower pad, and the upper pad and the lower pad are electrically connected. Consequently, the lower pad is not exposed to the environment.;COPYRIGHT: (C)2009,JPO&INPIT