An apparatus for engaging the notches to position the circumference of the circular wafer and a specified component, and the first plate notch position. Specified notch position component is the rear surface along a first axis configured to move linearly and including a forward elongated component which extends along a perpendicular second axis about the first axis and opposite the front surface, the front surface, and It has a first projection extending from the front surface of the elongate component. The first projection has a shape corresponding to the shape of the notch formed in the periphery of the circular wafer. When the notch positioning components to be driven along the first axis toward the periphery of the circular wafer, the value of the elongated configuration of the distance is measured and the measured distance between the front surface of the first plate and the rear surface of the element is a notch and the first It is used to determine the engagement of the protrusions. ;
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