The present invention includes a chamfered portion 4 for removing a notch of a wafer W, a cleaning portion 5 for cleaning and drying the wafer, and a chamfered shape measuring portion 7 for measuring a chamfered shape Wherein the chamfering section, the cleaning section and the chamfering shape measuring section are provided with a rotating stage for holding the wafer and a control means for controlling the rotating position of the rotating stage and the wafer, And the control means controls the rotation position at the start of rotation of the wafer and the rotation position at the start of rotation of the wafer, So that the rotational position at the time of termination is always a constant position. Accordingly, it is possible to perform appropriate feedback control even in the case of a notched wafer, to suppress irregularities in the chamfered shape, and to achieve the cross-sectional shape accuracy of the chamfered portion of a desired wafer.
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