COPPER FOIL EXCELLENT IN ADHESION WITH RESIN METHOD FOR MANUFACTURING SAME AND PRINTED WIRING BOARD OR BATTERY NEGATIVE ELECTRODE MATERIAL USING ELECTROLYTIC COPPER FOIL

摘要

An electrolytic copper foil having roughened particles formed on roughed surface (M side) of an electrolytic copper foil, wherein the average size of the roughening particles is 0.1 to 1.0 탆. It is possible to improve the bonding strength between the copper foil and the resin base material by improving the roughened treatment layer on the copper foil without deteriorating various properties of the electrolytic copper foil. In particular, compared with general-purpose epoxy resin base materials (FR-4 and the like) Provided is an electrolytic copper foil and a method for producing the electrolytic copper foil, which can obtain a stronger peel strength when used in combination with a substrate for a semiconductor package or a liquid crystal polymer substrate with low adhesion. An electrolytic copper foil useful as an electrolytic copper foil for a negative electrode material for a printed wiring board or a battery (such as LiB) is provided.