COPPER FOIL EXCELLENT IN ADHESION WITH RESIN METHOD FOR MANUFACTURING SAME AND PRINTED WIRING BOARD OR BATTERY NEGATIVE ELECTRODE MATERIAL USING ELECTROLYTIC COPPER FOIL

摘要

The electrolytic copper foil which provided roughening particle | grains in the roughening surface (M surface) of electrolytic copper foil, The average size of the roughening particle | grains is 0.1-1.0 micrometer, The electrolytic copper foil characterized by the above-mentioned. It is possible to improve the roughening treatment layer on the copper foil without increasing the various properties of the electrolytic copper foil, and to increase the adhesive strength between the copper foil and the resin substrate, and in particular, in comparison with general-purpose epoxy resin-based substrates (FR-4, etc.) When used in combination with the base material for semiconductor packages and the liquid crystal polymer base material with low adhesive force of, the electrolytic copper foil which can obtain a stronger peeling strength, and its manufacturing method are provided. It is a subject to provide the electrolytic copper foil useful as an electrolytic copper foil used for the negative electrode material for printed wiring boards or batteries (LiB etc.).