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CMP CATALYST COMPOSITION FOR TUNGSTEN POLISHING SLURRY AND CMP SLURRY COMPOSITION COMPOSITION COMPRISING THE SAME
CMP CATALYST COMPOSITION FOR TUNGSTEN POLISHING SLURRY AND CMP SLURRY COMPOSITION COMPOSITION COMPRISING THE SAME
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机译:用于钨抛光泥浆的CMP催化剂组合物和包含其的CMP泥浆组合物
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摘要
The present invention relates to a catalyst composition for tungsten polishing slurry, and to a chemical mechanical planarization (CMP) slurry composition including the same. According to one aspect of the present invention, the catalyst composition for tungsten polishing slurry includes a vanadium compound or a composite including the same. According to another aspect of the present invention, the CMP slurry composition includes: the catalyst composition for tungsten polishing slurry; a polishing particle; and an oxidizer.
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