BUMP STRUCTURE ON SEMICONDUCTOR CONNECTION PADS AND METHOD OF FORMING THE SAME

摘要

The disclosed is a bump structure on a semiconductor connection pad and a forming method thereof. According to an aspect of the present invention, the method for forming the bump structure on a semiconductor connection pad formed on a semiconductor wafer includes: a step (a) of forming a first photoresist layer around the semiconductor connection pad on the semiconductor wafer; a step (b) of forming a bonding wire on the semiconductor connection pad; a step (c) of receiving the bonding wire as a seed and plating the metal filler in a first groove formed on the first photoresist layer; a step (d) of forming a second photoresist layer on the top of the first photoresist layer; a step (e) of plating solder in a second groove formed on the second photoresist layer; and a step (f) of removing the first and second photoresist layers.