首页> 外国专利> METHOD FOR MANUFACTURING INFRARED SENSOR PACKAGE AND INFRARED SENSOR PACKAGE MANUFACTURED BY SAME METHOD

METHOD FOR MANUFACTURING INFRARED SENSOR PACKAGE AND INFRARED SENSOR PACKAGE MANUFACTURED BY SAME METHOD

机译:制造红外传感器封装的方法和用相同方法制造的红外传感器封装

摘要

The present invention relates to a method for manufacturing an infrared sensor package and the infrared sensor package manufactured by the same method. The method comprises: a sensor bonding process boding an infrared sensor and a gas sensor to an upper surface of a ceramic substrate; a wire bonding process connecting a wire to the infrared sensor and the gas sensor; a metal cap bonding process bonding a metal cap to the upper surface of the ceramic substrate; a getter bonding process inserting a getter in the inside of a cavity; a vacuum tube bonding process inserting a vacuum tube in the inside of the cavity; an external window bonding process bonding an external window to an opening; an evacuation process converting a status of the inside of the cavity to a vacuum state; and a getter activation process eliminating remaining gas in the inside of the cavity. According to the present invention, the method for manufacturing the infrared sensor package may minimize the remaining gas in the cavity in the inside of the package.;COPYRIGHT KIPO 2016
机译:本发明涉及一种红外线传感器封装的制造方法以及通过该方法制造的红外线传感器封装。该方法包括:将红外传感器和气体传感器结合到陶瓷衬底的上表面的传感器结合工艺;引线焊接工艺,将引线连接到红外传感器和气体传感器;金属盖键合工艺将金属盖键合至陶瓷基板的上表面;吸气剂结合工艺,将吸气剂插入腔体内;真空管粘接工艺,将真空管插入腔体内。外窗粘合工艺,将外窗粘合到开口上;抽空处理将空腔内部的状态转换成真空状态;吸气剂活化过程消除了腔体内残留的气体。根据本发明,用于制造红外传感器封装的方法可以使封装内部的空腔中的残留气体最小化。; COPYRIGHT KIPO 2016

著录项

  • 公开/公告号KR101632975B1

    专利类型

  • 公开/公告日2016-06-24

    原文格式PDF

  • 申请/专利权人 S-PACKAGE SOLUTION CO. LTD.;

    申请/专利号KR20150049165

  • 发明设计人 LEE WON OHKR;BAEK JUN YOUNGKR;

    申请日2015-04-07

  • 分类号G01J5/02;G01J5/04;H01L31/09;

  • 国家 KR

  • 入库时间 2022-08-21 14:12:23

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