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METHOD FOR MANUFACTURING INFRARED SENSOR PACKAGE AND INFRARED SENSOR PACKAGE MANUFACTURED BY SAME METHOD
METHOD FOR MANUFACTURING INFRARED SENSOR PACKAGE AND INFRARED SENSOR PACKAGE MANUFACTURED BY SAME METHOD
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机译:制造红外传感器封装的方法和用相同方法制造的红外传感器封装
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摘要
The present invention relates to a method for manufacturing an infrared sensor package and the infrared sensor package manufactured by the same method. The method comprises: a sensor bonding process boding an infrared sensor and a gas sensor to an upper surface of a ceramic substrate; a wire bonding process connecting a wire to the infrared sensor and the gas sensor; a metal cap bonding process bonding a metal cap to the upper surface of the ceramic substrate; a getter bonding process inserting a getter in the inside of a cavity; a vacuum tube bonding process inserting a vacuum tube in the inside of the cavity; an external window bonding process bonding an external window to an opening; an evacuation process converting a status of the inside of the cavity to a vacuum state; and a getter activation process eliminating remaining gas in the inside of the cavity. According to the present invention, the method for manufacturing the infrared sensor package may minimize the remaining gas in the cavity in the inside of the package.;COPYRIGHT KIPO 2016
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