Chip package for sensor camera module including the chip package and method of manufacturing the chip package

摘要

According to the present invention, there is provided a motorcycle comprising: a housing having a center opening and an end of each shaft having a bend; A first adhesive layer disposed on an inner surface of the housing; A lead portion which is adhered to the first adhesive layer and in which the inner lead portion and the outer lead portion are integrally disposed and the outer lead portion is electrically connected to the outside; And a sensor chip which is flip-chip bonded to the inner lead portion inside the housing, a camera module having the sensor chip package, and a method of manufacturing a sensor chip package.