WAFER PROCESSED BODY, TEMPORARY BONDING MATERIAL FOR WAFER PROCESSING AND METHOD FOR PRODUCING THIN WAFER

摘要

The present invention is a temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, containing a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer (A) capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and capable of releasably adhering to the support. There can be provided a wafer processing laminate and a temporary adhesive material for a wafer processing that facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method for manufacturing a thin wafer using the same.