WAFER PROCESSED BODY TEMPORARY BONDING MATERIAL FOR WAFER PROCESSING AND METHOD FOR PRODUCING THIN WAFER

摘要

The present invention is a temporary adhesive for wafer processing for temporarily bonding a wafer, which has a circuit surface to a surface and needs to be processed on a support, to a support, comprising a non-silicone thermoplastic resin layer (A) detachably adhered to the surface of the wafer. A second temporary adhesive layer composed of a first temporary adhesive layer, a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a thermosetting siloxane modified polymer laminated on the second temporary adhesive layer and detachably adhesive to the support. It is a temporary adhesive for wafer processing provided with the composite temporary adhesive layer which has a three-layered structure of the 3rd temporary adhesive layer which consists of layers (C). As a result, there is provided a wafer processed body which is easy to be temporarily bonded and peeled off, which is excellent in CVD resistance, and which can increase the productivity of a thin wafer, a temporary adhesive for wafer processing, and a method of manufacturing a thin wafer using the same.