RESIN COMPOSITION FOR SOLDER RESIST, FILM FOR SOLDER RESIST, CIRCUIT BOARD WITH SOLDER RESIST LAYER AND PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for solder resist that makes it possible to obtain a cured body with high rigidity.;SOLUTION: A resin composition for solder resist has (A) epoxy resin, (B) carboxyl group-containing photopolymerizable resin, (C) photopolymerization initiator, and (D) inorganic filler. The (D) inorganic filler is at least one compound selected from the group consisting of zirconia, barium titanate and ferrite, with the (D) inorganic filler content of 80-98 mass% in the solid content.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT