CONNECTION STRUCTURE, INKJET HEAD, METHOD FOR MANUFACTURING INKJET HEAD, AND INKJET RECORDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a connection structure capable of preventing, even if substrates each having a through hole into which adhesives need to be avoided flowing are made to adhere to each other, the adhesives from flowing into the through hole and conductive particles from aggregating.SOLUTION: One or both of respective adhesive surfaces of a first substrate 1 having a first electrode 15A formed on at least one of its surfaces and a second substrate 3 having a second electrode 33A formed on at least one of its surfaces are provided with at least one through hole, the first substrate 1 and the second substrate 3 are made to adhere to each other with an adhesive layer 5 interposed therebetween so that the first electrode 15A and the second electrode 33A are electrically connected to each other, and the adhesive layer 5 is formed of adhesives obtained by dispersing conductive particles 6 each having a plurality of protrusions formed on its surface due to interposition of filler particles 7 having a smaller particle diameter than that of the conductive particles 6.SELECTED DRAWING: Figure 5