PACKAGING RELIABILITY EVALUATION CHIP AND PACKAGING RELIABILITY EVALUATION METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a packaging reliability evaluation chip capable of efficiently performing a packaging reliability evaluation test and a packaging reliability evaluation method using the same.;SOLUTION: The packaging reliability evaluation chip is composed of a glass substrate 1 whose coefficient of thermal expansion at 20 to 250°C is 3 to 4 ppm/°C, an insulation resin layer 2 containing glass cloth laminated on a lower surface of the glass substrate 1 whose coefficient of thermal expansion at 20 to 250°C is 3 to 5 ppm/°C and a pseudo terminal 3 made of copper formed on a lower surface of the insulation resin layer 2 containing glass cloth.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT