FLUX COMPOSITION FOR NON-CLEANED SOLDER PASTE AND NO-CLEAN SOLDER PASTE, AND FLUX SCATTERING EVALUATION METHOD OF SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a flux composition for a no-clean solder paste and a no-clean solder paste, which make it possible to specify whether or not an organic substance adhering to a substrate after mounting is derived from the flux composition without affecting other characteristics of the flux composition and the solder paste, and a flux scattering evaluation method using the same, and to provide a flux composition capable of exhibiting good insulating properties of a flux residue.;SOLUTION: There is provided a flux composition for a no-clean solder paste, comprising (A) a base resin, (B) a surfactant,C) a solvent and (D) an organic compound having a rhodamine skeleton or a coumarin derivative containing coumarin as a basic skeleton, where the solvent (C) contains diethylene glycol monohexyl ether.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT