A leaded and lead-free solder paste evaluation screening procedure.

摘要

Surface mount technology (SMT) is used in the electronics industry in the design and assembly of circuit boards. It is the use of flat pads on the surface of a board combined with components designed such that their connecting leads can be soldered onto the pads. It has replaced, to a great extent, conventional through-hole technology, in which the components had leads which passed through the board and which were soldered on the opposite side to the component body.; This thesis describes the application of a solder paste evaluation procedure based on simple designed experiments and the measurement of critical solder-paste-related process metrics. The goal of this procedure is to maximize information about a solder paste and its processing ability while minimizing experimentation. Six of the industry's highest performing no-clean and water-soluble solder paste formulations (out of which, five samples were lead bearing solder paste formulations and one sample was lead free solder paste formulation) were tested. (Abstract shortened by UMI.)